SC-SU-II Magnetron sputtering (Dielectric & Non-Metal Capable)
$0.00
Target Compatibility: Specifically engineered for both conductive metals and non-metallic/dielectric materials (e.g., ceramics, oxides, polymers).
Effective Sputtering Area: Ø 50 mm (Optimized for standard 2-inch magnetron targets).
RF Power Supply: 1 – 500 W (Continuously adjustable for precise deposition control).
RF Matching: Equipped with an advanced Automated Impedance Matching Network to ensure optimal power transfer, maximize plasma stability, and minimize reflected power without manual tuning.
Process Chamber: High-purity Quartz Vacuum Chamber for excellent plasma visibility and zero metallic cross-contamination.
Chamber Dimensions: 150 mm × 120 mm
Ultimate Vacuum / Base Pressure: ≤ 5 Pa
Maximum Deposition Rate: Up to 8 nm/min (Material and power dependent).
Process Gas Compatibility: Supports precision introduction of Argon (Ar), Nitrogen (N₂), and other inert or reactive process gases for complex film stoichiometry.
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Lead Time & Order Processing
Orders will be dispatched within 5 working days after payment confirmation, excluding weekends and public holidays. Once shipped, order cancellation or modification is not accepted.
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Returns or refunds for non-quality reasons are not supported. The product comes with a 1-year international warranty. A 2-year extended warranty is available for an additional fee.